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EUV PELLICLE

What is an EUV pellicle?

A critical semiconductor component in the form of an ultra-thin membrane, designed to protect costly EUV masks from particle contamination. It lets light pass through while keeping particles out of focus, so that contaminants landing on the mask surface are not transferred onto the wafer.

Particle contamination mitigation by EUV pellicle
Pellicle particle-protection principle in the EUV lithography process
EUV lithography process — the pellicle pushes particles out of focus, preventing transfer onto the wafer
STRUCTURE

EUV Pellicle Structure

Cross-sectional TEM · Tri-layerPellicle cross-sectional TEM image — tri-layer structure

Tri-layer ultra-thin membrane under 20nm

The pellicle membrane consists of a tri-layer structure, with a total thickness of under 20nm. It is designed to transmit as much extreme ultraviolet light as possible while simultaneously securing mechanical durability and thermal stability.

< 20nm
Total membrane thickness
3-Layer
Tri-layer structure
Full-size
Mass-production-grade membrane
Next-generation material R&D for high-power EUV sources
Si-based materialMetal silicide (MeSi)Nano material (Nano)Carbon-based material
PROCESS

How an EUV pellicle is made

Si-based pellicle manufacturing process — a 6-step flow that starts from a wafer and leaves only the ultra-thin membrane

1
Wafer preparation
Wafer preparation
2
Membrane deposition
Membrane deposition
3
Etching mask deposition
Etching mask deposition
4
Backside patterning
Backside patterning
5
Si wet etching
Si wet etching
6
Full-size pellicle
Full-size pellicle
FRAME & ASSEMBLY

Pellicle-Frame Assembly

We combine our in-house developed pellicle and frame to build the completed assembly.

In-house developed pellicle membrane
In-house developed pellicle
Pellicle membrane
+
In-house developed frame
In-house developed Frame
Pellicle frame
Pellicle-frame assembly
Pellicle-Frame Assembly
Assembled pellicle
PERFORMANCE

S&S TECH Pellicle Performance

CategoryItemMeasured value
Membrane · OpticalTransmittance92 ± 0.5 %
Reflectance0.015 ± 0.005 %
Membrane · MechanicalTensile strength (UTS)2.4 ± 0.2 GPa
Rupture pressure50 ± 5 Pa
ReliabilityLifetime25K wafers @ 500W
Membrane out-gassing (RBS)No change
DefectivityNo particles ≥ 10 µm
Frame (in-house developed)Out-gassingPass
Acceleration35 G

* The figures above are representative values based on our own measurements; product specifications may vary depending on customer requirements and process conditions.